The Centre for Heterogeneous Integrated MicroElectronic and Semiconductor Systems (CHIMES2)

Heterogeneous Integration (“HI”) is a disruptive foundational technology driving change in the semiconductor industry. It could allow the UK to regain competitive advantage rather than become a niche player if exploited. Global tier 1 vendors are looking to exploit it to dominate future markets and counter disruptive change from open hardware IP communities such as RISC-V. UK innovators need a low-cost entry into HI systems. The Centre for Heterogeneous Integrated MicroElectronic and Semiconductor Systems (CHIMES2) will act as a concentration point for the UK design community, delivering low-cost entry via knowledge transfer in HI design anchoring semiconductor systems design and economic benefit in the UK. The UK design community currently targets offshore manufacturing via standard design practice, leading to decoupling from significant innovation in the UK science base and UK pathways to manufacture. This UK cannot exist in isolation, and the UK design community will utilise both UK and non-UK pathways to manufacture, but design enabled by HI will bring the component parts together and allow reconnection of UK supply chains. CHIMES2 will bridge the gap between design teams, science and manufacturing via knowledge transfer and innovation translation pathways in HI. HI will disrupt and open up supply chain opportunities for the UK but increases risks that could undermine vital UK cyber security resilience. To address these risks, CHIMES2 will develop resilient system architecture and design methods building on UK investments such as the Research Institute in Secure Hardware and Embedded Systems. New verification methods for Heterogeneous Integration of design IP independent of pathway to manufacture will be developed. This will enable open yet resilient supply chains for components aggregated into systems by HI. CHIMES2 will develop translational pathways that feed foundational research innovation from materials through devices and into systems that demonstrate industry-relevant HI impacts. It will raise the UK's profile, increase research metrics and IP filing in HI. CHIMES2 will capture, disseminate and maintain fundamental HI design knowledge, providing both context for future innovation and practical means to accelerate its transition to industrial use. Strategically, ensure awareness of UK and global advances in semiconductors, advanced packaging, test and verification, where HI is an enabler to improve system design, focusing on UK specialisms. Coordinate the community via knowledge transfer of assets, including needs and technology roadmaps and UK capability landscapes, which are developed and shared widely with the community. Tactically, provide easily accessed design assets for low entry costs to key markets. These include; architectures, design patterns, exemplar reference designs, and tool flows for HI System Design, enabling academia and innovators to prototype novel systems in time for market demands. Upskill the UK design community: A Skills and Training activity for Heterogeneous System Co-Design will be developed and deployed into various curriculum pathways to upskill the current and prepare the next generation UK workforce. These skill development assets will be built on our maintained design commons and secure systems architecture. CHIMES2 will validate interventions by industry-led co-created projects, our initial cohort partners are execution-ready (see letters of support). These partners cover a range of markets where the UK has strength, power management, wireless communications, photonics and sensors. Example systems where HI can have impact are; 5G/6G transceivers, medical and defense-oriented sensing devices, control of efficiency in power conversion, and photonic integration across multiple materials.